SI4732 V6.8 Upgraded Version! ! ! Using FPC 0.2mm thin board, compared with the traditional fiber thick board PCB, it reduces the parasitic inductance to the ground. And the speaker is not installed on top. Using the on-board interface, the board does not need to solder the feeder. In addition, the top ground wire has a welding hole on the right side of the fixed position. The soldering iron can be soldered firmly with a light touch, which greatly reduces the difficulty of installation and construction. ient suppression diode is added to suppress ient voltage, and the parasitic capacitance of the protection component itself the impedance matching during the original signal mission, preventing the signal from being distorted. The internal amplifier circuit IC uses components with a maximum signal gain of 19dB. There is no need to use an external active antenna like the old version. Only an ordinary pull-rod antenna is needed to obtain good reception performance. (Not included) Add an audio amplifier circuit to solve the problem of low volume of SSB single-sideband in CEC English firmware. FM (frequency modulation) and HF (amplitude modulation medium and short wave) bandpass filters are added to the adapter board, which has stronger anti-interference ability. High-quality high-frequency winding chip inductors are , with high Q value, small internal resistance and stronger filtering selectivity. The soft board FPC uses a non-glue substrate, and PI is divided into two types: glue substrate and non-glue substrate. This product uses a non-glue substrate, which is more to high temperature and has a longer life. The cost of using immersion gold process is higher than that of traditional tin-plated plate, which has higher reliability and stability in conductivity and oxidation resistance. The components are soldered by machine, which has a higher yield rate than traditional manual soldering, and