brand new and high quality Features: It has high strength and fast bonding effect. Used to paste heat sink with IC chips,and be cooling body with good thermal effect. It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. It has good conductivity, wide temperature range (-60~200C) and short-term resistance to 300C. In addition, it has short surface curing for time, strong bonding force, long storage period, non-toxic, solvent-free. It can be safely applied in the elastic bonding, heat dissipation, insulation and packaging of electronics, electrical appliances, instruments, LEDs, heat sinks and other industries. Instructions: 1. When using, directly extrude the product, rub the surface of the adherend, and cover it immediately after use, in for case of trial again; 2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa; 3. the recommended thickness of the application: 0.1-0.5mm, the thinner the better. 4. Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean. Specification: Thermal conductivity: >0.671W/for m.k Breaking strength: 1.5MPA Surface vulcanization time: 10Min/25C Material: Silicone Capacity: 5g Length: 52mm/2.05inch Color: As shown Quantity: 1 Pc Note: 1.Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid. 2.Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you! Package includes: 1 x Thermal Silicone Adhesive